Machining Equipment

DMG CMX 50U (1 unit)

5-axis machining solution – featuring a direct measuring system and IoT connection as standard equipment

  • Max. X-axis travel: 500 mm
  • Max. Y-axis travel: 450 mm
  • Max. Z-axis travel: 400 mm
  • Max. workpiece diameter: 630 mm
  • Max. workpiece height: 550 mm

DMG MORI CLX 450 (1 unit)

With driven tools

  • Max. turning diameter: 400 mm
  • Max. workpiece length: 800 mm
  • Max. bar capacity: 80 mm
  • Max. X-axis travel: 276 mm
  • Max. Z-axis travel: 755 mm
  • Driven tool speed: 4000 RPM

Bambu Lab H2D (1 unit)

3D printer with material engraving and cutting capabilities

  • Build volume: 325 × 320 × 325 mm
  • Print technology: FDM
  • Supported materials (Filaments): PLA, PETG, TPU, ABS, ASA, PC, PA, PPA-CF/GF, PPS, and various carbon- or glass-fiber reinforced variants
  • Laser module: 10W laser for material engraving and cutting

Engraving Laser (1 unit)

  • MOPA Fiber laser
  • Laser power: 30W
  • Max. Z-axis (from lens to working plate): 550mm

 

Measuring Equipment

Wenzel XO87 (1 unit)

Measuring ranges:

  • X-axis: 800 mm
  • Y-axis: 1000 mm
  • Z-axis: 700 mm
  • Max. workpiece weight: 800 kg

Measuring accuracy according to DIN EN ISO 10360

  • Accuracy grade: Premium
  • Temperature range: 20 °C ± 2 K, 1 K/h, 1 K/m, 2 K/d

With probing system, module TP200:

  • MPE (μm) = 2.8
  • E0, MPE (μm) = 2.4 + L/300 (L in mm)
  • E150, MPE (μm) = 2.4 + L/300 (L in mm)
  • R0, MPL (μm) = 2.4

Mitutoyo LH 600 (1 unit)

  • Measuring range (stroke): 0 to 977 mm (600 mm)
  • Resolution (selectable): 0.0001 / 0.001 / 0.01 / 0.1 mm
  • Repeatability (2σ):
    • Plane: 0.4 µm
    • Bore (hole): 0.9 µm
  • Perpendicularity: 5 µm (after compensation)
  • Linearity: 4 µm (mechanical)
  • Measuring force: 1 N (with automatic constant force function)
  • Drive method: Motorized drive (5–40 mm/s in 7 steps) or manual operation